• Manufacturing Support Process for Grace SF5-18/SF5-25 production sustaining & enhancement
• WAT analysis and yield correlation
• WAT, in-line trend chart monitoring and analysis
• Work with fab and product engineer to enhance product yield.

• Strong background in semiconductor physics, process and module (etch, plasma, physics and advance cleaning) knowledge and experiences.
• Familiar with SPC control
• Good communication and interpersonal skills
• Team and detail oriented personality

• BS OR MS in Electrical Engineering, Physics or Material

• Minimum 3 years of Semiconductor industry experience
• Fab PIE module experience preferred.

Job Description and Responsibilities:

• Lead a team to develop SuperFlash technology with foundry partner in China.

• Strong background in semiconductor physics and process
• Good project management, communication and interpersonal skills
• Leadership capability in a cross functional environment
• Managerial experience is required

• MS/Ph.D in Electrical Engineering, Physics or Material Science

• Minimum 10 years of semiconductor industry experience
• Process Development/Process Integration Engineer

Job Description and Responsibilities:

• Maintain corporate guidelines to develop marcom plan to enhance corporate image in the industry.
• Interface with Business Units, Sales & Marketing to define the required promotional activities to position focus products in the target market segment.
• Maintain "partnership" relationships with strategic agencies to facilitate their support in accomplishing stated objectives.
• Collaboratively establish and maintain marcom budget for the company. - Conduct communications research.
• Development and localization of press materials.

• Advertising (creation & adaptation)
• On-line marketing
• Printed collateral
• Tradeshows/Exhibits/Conferences
• Seminars
• Market research
• Publications/newsletters
• Database management

• 5 - 8 years experiences in marcom, preferably in semiconductor or the high tech sector
• Excellent communications skills - verbal and written Ability to communicate in Chinese and Eglish - verbal and written
• Ability to work independently, result-oriented, multi-tasking required
• Ability to work in a teaming environment and collaborate with co-workers
• University degree in Marketing, Communications, Business or related subjects.

Job Description and Responsibilities:

• Prepares CMOS layout drawings and design of Integrated circuits form schematics or logic diagrams.
• Specifications, and new configurations.
• Understands basic memory organization, hand-on experience with memory peripheral circuits.

• Designs cells and macro cells from detailed schematics.
• Is proficient at Opus CAD system.
• Knowledge of UNIX, SUN Workstation, Cadence / VIRTUOSO, and Hercules desirable.
• Be able to resovle LVS and DRC errors with minimal help.
• Is adequate in English communication skill.

• A technology related degree or equivalent combination of training and experience.

• At least +3years in IC layout design.

Job Description and Responsibilities:

• Responsible for IC design and developments.
• This position will be involved in product designs, simulations, layout and verification, tape-out, debugs and characterization.

• Knowledge of non-volatile memory a definite advantage.
• Tools used may include of Verilog, Synopsys synthesis tools, HSPICE, Cadence Design Entry, IC layout tools, Dracular or other equivalent tools.
• BSEE required, MSEE preferred.
• 2+years experience

• A technology related degree or equivalent combination of training and experience.

Key Competency Requirements:

• Strong Logic design experience.
• Familiar with Verilog HDL, Synopsys dc comiler and Prime time,and ASIC design flow.
• Tape out and debugging experiences required.
• DSP or Backend design experience is a plus.

• Min. 3 + Years experience.

• A technology related degree or equivalent combination of training and experience.

• Logic Design, ASIC design,DSP

Job Description and Responsibilities:

• The candidate will need to work with logic designer to define/verify the SOC system on PCB board.
• The job responsibility including Board level design/debug, firmware developing and system level SOC chip verificationIdeal candidate must be independent, quick learner, and result oriented

• Hand-on experience on Altera FPGA, design/debug PCB and system level SOC chip verification are must.
• Familiar with Assembler language, C/C++, compiler, ARM architecture, and firmware experience is preferred.
• Knowledge of Flash interface, IDE, ATA, USB, 8051 and Window programming will be a plus.

• BSCS/EE, MSEE/MSCE preferred.

• 3+ Year Experience required.

Job Description and Responsibilities:

• Design, implement and maintain embedded firmware for Flash Drive Product(including CF,ATA and USB).
• The candidate will be involved in the whole design cycle and responsible for design and implementation.
• The job covers understanding exist firmware structure and implementation and improving or adding new features for the product, as well as solving all related compatibility problems.
• When new project is launched, the candidate will be able to move to new firmware development.
• This candidate will work at SST China Beijing Office.

• Proficiency in C and assembly language.
• Ability to use debug tools such as logical analyzer, oscilloscope and bus analyzer.
• ATA/CF/USB interface experience is preferred.
• Knowledge of Computer System Architecture, Data Structure and Language Compiler is a must.
• Ability to handle software system with more than 10K lines of C code.

• BS or MS of Computer Science & Engineering

• 5 year+BS, Proven history in embedded firmware development or system level software development

Job Description and Responsibilities:

• Responsible for hiring, training, and managing a software team for embedded controller applications and tools.

• Experience with various OS and RTSs (VxWorks, Nucleus, WinCE, WinMobile, Symbian, LINUX),embedded compilers (ARM, Platform builder, CodeWarrior, Visual DSP++), emulators (JTAG, SoftICE etc) and debuggers.
• Proven experience in writing Interrupt Service Routines and code that controls peripherals at the register level.
• Image processing experience desirable. Must know how to use Logic Analyzers, Oscilloscopes as part of debugging.
• Must have excellent experience in developing modular, extensible and highly reliable code.
• Proven analytical and independent problem-solving skills, must be a team player with good communication skills.

• BS in Computer Science, MS preferred; English fluency at Level6

• Seven to ten years of embedded programming experience with increasing responsibilities in a lead design and development role.
• Strong embedded firmware experience with 8,16 and 32-bit microprocessors.
• Proven skills with ARM, XSCALE and other embedded processors. Experience with Motorola, ADI DSP, 8051 descriable.
• Expertise in developing portable and efficient code in C for embedded platforms. Experience in C++ desirable.

Job Description and Responsibilities:

• Design, verify and debug advanced ASIC/SOC product.
• The candidate will be involved in the whole cycle of ASIC/SOC design from specification, HDL coding, simulation, synthesis, tapeout, debug to mass production.
• The candidate also need to understand the old design and add new features.
• The location is SST China Beijing office

• Familiar with ASIC/SOC design flow, Verilog HDL, synthesis, DFT, static timing analysis.
• Experiences in interface such as USB,SPI,UART,12C and 8bit/32bit CPU core such as 8051 and ARM7 core.
• Good team player

• BS or MS of EE

• 1 year+MS or3+ BS.Proven history of ASIC or SOC or complex FPGA design.

Job Description and Responsibilities:

• The candidate will need to work with logic designer to define/verify the SOC system on PCB board.
• The job responsibility including Board level design/debug, firmware developing and system level SOC chip verification.Ideal candidate must be independent, quick learner, and result oriented

• Hand-on experience on Altera FPGA, design/debug PCB and system level SOC chip verification are must.
• Familiar with Assembler language, C/C++, compiler, ARM architecture, and firmware experience is preferred.
• Knowledge of Flash interface, IDE, ATA, USB, 8051 and Window programming will be a plus.
• Project management experiences on hardware and system.

• BSCS/EE, MSEE/MSCE preferred.

• 10+ Year Experience required for BS.
• 6+ Year Experience required for MS.

Job Description:

• Provide "frontline" technical support for the sales team.
• Establish contact with customer's technical teams to get early alerts for any technical issues.
• Lead and set priority for local customer support team.
• Plan and expand on test lab. capabilities for faster thru put for customers.
• Collect information from customer to help with failure analysis/evaluation.
• Perform electrical failure analysis.
• Manage outside vendors for any physical failure analysis.

• Present SST reports and analysis to customers.
• Review failure analysis reports before distributing to customers.
• Collect qualification and characterization data, format data into presentation material for customers.
• Manage customer technical support engineering activities.
• Keep SST/Taiwan and SST/Sunnyvale informed of customer status.

• Communications:? Ability to work with customer and lead F/A team.? Also need to communicate issue to other team members.? Must be fluent in Chinese AND in English, written and verbal.
• Technical: Must be able relate issues back to FLASH device specifications,product manufacturing process/procedures and test coverage...will need to be able to use memory test equipment, scope customer applications and perform some package and reliability testing.
• Previous experience with customer support and basic PC motherboard debugging skills a plus.

• 5 to 10 years of semiconductor manufacturing experience;preferred experience to be in FLASH memory production.? Any board level design and manufacturing experience is a plus.

Job Description and Qaulifications:

• Import fab house/sort facility ship alerts
• Review WAT missing/out-of-spec data
• Support other group's needs relevant to logistic issues
• Review foundry WIP report
• Hold weekly meeting with foundry
• Invoice verification and approval
• Generate monthly wafer PR/PO
• Wafer/die price quotation maintenance
• Review foundry's monthly wafer start/shipment performance

• BS or above in EE

• 5+ years relevant experience, with experience in Wafer Foundry is prefered.

Job Description and Responsibilities:

• Responsible for Assembly Allocation & Capacity
• Responsible for Assembly Cycle Time Monitoring
• Responsible for Assembly Material Inventory Monitoring
• Responsible for SST Inventory Accuracy
• Responsible for Vendor's daily Wip, Transaction, other reports accuracy
• Responsible for Assembly Release Instruction (ARP) to Vendors
• To dispatch the daily schedule and review Vendor's Ioading to ensure line balance
• Coorinating Vendors to expedite the production
• Responsible for cost down solution & price negotiation

• Experience in Production Control such as Planning, Coordinationg, and Scheduling production operations

• 5+years in semiconductor Assembly Operations

• B.A. or B.Sc.

Job Description :

• Maintain corporate guidelines to develop marcom plan to enhance corporate image in the industry.
• Interface with Business Units, Sales & Marketing to define the required promotional activities to position focus products in the target market segment.
• Maintain "partnership" relationships with strategic agencies to facilitate their support in accomplishing stated objectives.
• Collaboratively establish and maintain marcom budget for the company.
• Conduct communications research.
• Development and localization of press? materials.Tactics include (but are not limited to):
• 1.Advertising (creation & adaptation)
• 2.On-line marketing
• 3.Printed collateral
• 4.Tradeshows/Exhibits/Conferences
• 5.Seminars
• 6.Market research
• 7.Publications/newsletters
• 8.Database management
  

• 5 - 8 years experiences in marcom, preferably in semiconductor or the high tech sector
• Excellent communications skills - verbal and written Ability to communicate in Chinese and English - verbal and written
• Ability to work independently, result-oriented, multi-tasking required
• Ability to work in a teaming environment and collaborate with co-workers
• University degree in Marketing, Communications, Business or related subjects.

Job Description and Responsibilities:

• Creating and managing the execution of a business plan.
• Driving design wins at key accounts and at chipset suppliers.
• Deep understanding of customer technical needs in their end systems for the future and devising new products to satisfy those needs.
• Managing the profitability of a set of products through price control.

• Strong technical background.
• Achieved via experience with a mobile phone chipset vendor.
• Good written and verbal communication skills in both English & Chinese.
• Team player and strong drive a must.

• 5-8years working experience in the semiconductor field.
• Preferably with a consumer products vendor.
• Experience with Flash memory a plus.
• Customer and marketing experience desirable.

Job Description and Responsibilities:

• Production Planner for Operations Planning
• Plan and schedule product assigned to you using Oracle and Acess databases.
• Monitor the supply demand activity to ensure all needs are being met.
• Review forecast and input to the build plans.
• Work with backend manufacturing, factory planning, engineering,wafer foundry,the business units, sales and segment marketing groups.
• Generate quarterly MBO'S for this position.
  
• Work to meet our corporate MBO'S.

• Excellent Computer skills(Excel,Access,Microsoft word and Outlook,Oracle/Oracle discover reports).
• Detailed oriented person with good organizational skills.
• Ability to multi-task and prioritize well.
• Manager for Results.
• Reliable,dependable individual.

• Industrial engineering or a Business degreee required

• Speaks English and mandarim fluently. College with some business experience required.